HSC Thermal Grease

FOVAC® HSC Thermal Grease is a synthetic heat transfer compound that increases the thermal conductivity of a thermal interface by filling microscopic air gaps present due to the imperfectly flat and smooth surfaces of the components. In electronics, it is often used to aid a component’s thermal dissipation via a heat sink.

FOVAC ® HSC is heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed, and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 o C (350 o F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.